Electronics Process Technician - Casual Status

One team. Global challenges. Infinite opportunities. At Viasat, we’re on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We’re looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.

Viasat Operations Engineering seeks an Electronic Rework Specialist for “On-Call” support! This role involves onsite Printed Wiring Assembly (PWA) rework in the E3 lab. Tasks include component-level rework and BGA, QFN, CSP, or LGA rework on PWAs or equivalent experience. The job also requires inspection and rework documentation to support engineering and operations. Workmanship shall meet applicable IPC/J-STD standards per program requirements (e.g., IPC-A-610, J-STD-001, and IPC-7711/7721).

The Contractor shall handle, rework, repair, and inspect all electronic components and assemblies in accordance with generally accepted industry practices for Electrostatic Discharge (ESD) control. All Services involving ESD‑sensitive devices shall be performed using appropriate ESD precautions, including but not limited to proper grounding, ESD‑safe tools, work surfaces, and handling methods, to prevent damage to Company materials and products.

• Component-Level Rework (SMT / Through-Hole)
  • Remove and replace discrete components (0402/0201 resistors/caps, diodes, inductors) using hot air and/or soldering iron.
  • Remove and replace ICs (QFN, DFN, SOIC, TSSOP) including site prep, pad cleaning, and re-solder.
  • Replace through-hole components (connectors, headers, relays, transformers) including de-soldering and rework of plated-through holes.

• Area Array / Advanced Package Rework (Expanded BGA Examples — if applicable)
  • Perform BGA/LGA removal using controlled preheat and top-side heating per approved profile, including fixture setup and thermocouple placement (as required by instruction).
  • Complete site dressing after removal: solder removal (wicking), pad cleaning, flux residue cleaning, and inspection for pad integrity, solder mask damage, or substrate delamination.  
  • Perform pad/land pattern inspection under microscope to identify lifted pads/pad cratering indicators, solder mask damage or exposed copper, and bridging risk due to solder smear or pad deformation.
  • Install replacement BGA/LGA using alignment aids (optical/mechanical) and controlled reflow profile; verify component placement and standoff consistency per workmanship criteria.
  • Conduct BGA reballing (only if authorized): de-ball and clean component, stencil/ball placement using approved sphere size/alloy, controlled reflow to attach spheres, and post-reball inspection for missing/bridged spheres and uniformity.
  • Replace fine-pitch/high-I/O BGAs requiring tighter alignment tolerances, controlled soak, and warpage mitigation steps (per work instruction).
  • Rework BGAs with ground/thermal balls or large copper planes requiring enhanced preheat/soak to manage thermal mass and avoid cold joints.
  • Perform localized underfill or corner-bond removal and re-application (if applicable and authorized), including site cleanup, controlled dispense, and cure per process parameters.
  • Mitigate adjacent component risk during BGA rework using heat shields/masks and localized thermal protection; document any collateral reflow/touch-up performed.
  • Support moisture sensitivity handling (as applicable): verify MSL exposure tracking, perform bake-out per instruction prior to rework, and record bake parameters/exposure window.
  • Perform post-rework verification as directed: microscope inspection of package edges/alignment, basic electrical checks (shorts-to-ground/continuity) if specified, and coordinate X-ray/2D inspection submission and disposition tracking if required.
  • Complete multi-pass BGA rework scenarios (if authorized) with full documentation of thermal excursions and rationale.  
  • Maintain process control artifacts for BGA work: profile name/ID, key profile parameters, flux/paste type, alloy, stencil/reball stencil ID (if used), and component lot/date code (when available).

• PCB/Pad/Trace Repair (As Authorized)
  • Repair lifted pads/traces using approved trace repair kits/methods (jumper wires, epoxy repair) per engineering disposition.
  • Perform via repair/rework as permitted by process instructions.
  • Reinforce mechanically stressed joints (e.g., connector tabs) with approved solder and technique.

• Cleaning / Coating / Consumables Handling
  • Perform localized cleaning of flux residues using approved solvents and methods.
  • Remove and re-apply conformal coating in designated rework areas (masking/demasking) as required by instruction.
  • Apply adhesives/epoxies under controlled conditions (mix ratio, cure time/temperature) when specified.

• Inspection and Verification Support
  • Conduct microscope inspection before/after rework to verify solder joint quality and component alignment.
  • Support continuity checks and basic electrical verification as directed (e.g., shorts check, diode check).
  • Identify and document workmanship defects (bridging, insufficient solder, tombstoning, damaged pads, misalignment).

• Task 6 - Documentation / Traceability Requirements
  • Complete rework travelers including: serial number, description of work performed, parts/lot numbers used, date/time, and technician signature.
  • Capture nonconformance observations and communicate to engineering (e.g., unexpected damage, missing components, suspected heat damage).
  • Provide rework evidence as allowed (photos only when permitted by data/security rules).

• Demonstrated hands‑on experience in electronics rework, primarily on SMT assemblies; BGA/LGA/CSP rework experience preferred where applicable.
• Proficiency with microscopes, XRAY, hot air/ and Airvac rework stations, soldering irons, and standard hand tools.
• Familiarity with IPC/J-STD workmanship standards (e.g., IPC-A-610, J-STD-001, and IPC-7711/7721).
• Strong documentation rigor and ability to follow controlled work instructions.  
• Ability to work in ESD-controlled environments and align with safety requirements.  
• Strong understanding of soldering processes and materials, including SnPb and lead‑free alloys, flux types, thermal profiles, and cleaning methods.
• Ability to perform and document microscopic inspection and identify common workmanship defects (e.g., opens, bridges, insufficient solder, lifted pads, misalignment).
• US ciztienship required

• Good Communication Skills
• Ability to work nights and weekends as needed
• Experience using Jira to track tasks and manage internal ticketing system

Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click here.