Ciena
Telecommunications Equipment Manufacturing
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As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact.
Ciena is expanding its Interconnects business across China, Taiwan, and the broader Asia region, enabling next-generation AI, cloud, and compute infrastructure. This role provides technical leadership that connects customer requirements with optical interconnect and silicon solutions, influencing product adoption and long-term business growth. The position combines customer-facing engineering engagement with cross-functional collaboration across business development, product management, and engineering teams.
How you will make an impact:
Lead pre-sales technical engagement for Ciena’s Interconnects portfolio across hyperscalers, OEM/ODMs, and AI/compute system partners.
Drive lab bring-up, debugging, interoperability validation, configuration, and performance testing activities.
Translate customer system architectures and requirements into technical solution recommendations and product roadmap input.
Guide complex design-win opportunities from evaluation through production in partnership with business development and account teams.
Serve as the primary technical interface for proof-of-concepts, interoperability events, compliance activities, and early deployments.
Deliver technical workshops, product demonstrations, architecture reviews, and executive-level technical presentations.
Gather ecosystem, competitive, silicon, and optical interconnect insights to inform product lifecycle management and roadmap alignment.
The must haves:
Experience: ~10 years in sales/solutions engineering, high-speed hardware, optical interconnect, silicon bring-up, or datacenter systems engineering.
Application of DSP/retimer, SERDES, optics/pluggables, AEC/ACC, PCIe, Ethernet, high-speed test equipment, or related technologies.
Experience working directly with Asia-based hyperscalers, cloud builders, OEMs, or ODMs.
Utilization of oscilloscopes, BERTs, IBIS-AMI, simulation tools, or signal integrity tools for debugging and validation activities.
Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a similar field.
Fluent Mandarin and professional English communication skills, including written and spoken communication.
Documentation, presentation, and communication skills supporting collaboration across engineering, product management, and commercial teams.
Nice to haves:
Education: Master’s degree in Electrical Engineering, Computer Engineering, or a similar field.
Reading proficiency in Traditional Chinese to support Taiwan customer engagement.
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At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.
Ciena is an Equal Opportunity Employer, including disability and protected veteran status.
If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.
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