Principal Analog MixedSignal Design Engineer
Offer summary
Qualifications:
Bachelor's degree in Electrical Engineering or higher (MSc or PhD) with relevant experience., 10-15 years of industry experience in high-performance RF/Analog Receiver/TIA design or 5+ years with a master's or PhD., Proven IC design experience including chip tape-out and lab evaluation., Strong skills in EDA CAD tools, analog custom layout, and measurement of IC performance..Key responsibilities:
- Design and lead the development of high-performance transimpedance amplifiers in SiGe BiCMOS technology.
- Develop transmission line and millimeter wave structures for enhanced performance.
- Collaborate with teams for post-silicon validation, qualification, and transition to production.
- Guide and mentor junior designers and oversee circuit implementation and testing.
Job description
Company Description
CCG Talent Management is not only a business solutions company but a company that believes success starts with the individual. CCG Business Solutions has been consulting and providing talent placement services since 2007. Our team understands the principles of connecting purpose to business. We are currently recruiting for a Principal Analog MixedSignal Design Engineer.
Job Description
The Principal Analog MixedSignal Design Engineer will contribute to the development of multitens of GHz Transimpedance amplifiers TIAs. These optical interface chips are tightly coupled with our highperformance equalizers. The results of our innovative designs have made our TIAs best in class for coherent longhaul and metro systems as well as PAM4 data center systems. Hybrid position, must work inoffice two (2) days a week.
Responsibilities:
- Active circuit design as well as technical leadership.
- Design leading edge transimpedance amplifier design, primarily in Silicon Germanium (SiGe) BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) technology, where circuit performance will need to transcend beyond industry leading products.
- Develop transmission line structures and other millimeter wave structures to enable higher performance than would normally be achievable.
- Design of hiperformance broadband analog circuits for optical frontend receivers.
- Design of various other analog circuits including linear regulators, AGC loop, currentvoltage sensors, bandgaps etc.
- Develop microarchitecture of major circuit blocks and guide team of designers to implement them. Work with various technologies including SiGe BiCMOS and CMOS.
- Work with other functional groups to facilitate postsilicon validation, qualification, transition to mass production, and customer support.
QualificationsBachelor’s degree in Electrical Engineering
Must have the following skillsbackground in the areas of design of highperformance RFAnalog ReceiverTIA design and 10 15 years experience Or MSc EE Or PhD EE with 5+ years of experience in the areas of design of highperformance RFAnalog ReceiverTIA design.
- Proven experience in IC design including chip tapeout AND lab evaluation of receiver design working in the industry).
- Solid experience in.
- Using EDA CAD tools
- Performing Analog Custom Layout
- Experience in measuring IC performance and debug of design to correlate simulations to measurements
- Deep understanding of fundamentals, including:
- Detailed transistor level design
- Device physics
- ControlFeedback loop stability analysis
- Direct project experience in at least one of the following areas is a plus:
- AGC loop design
- High precision analog circuits (Including linear regulators, current sensors, bandgaps and DACADC)
- Experience in CTLE design
- Experience in PackageSystem integration issues desired
- Project experience in using different technologies. (SiGe BiCMOS is a plus)
- A teamplayer
- Experience in the following is a strong plus:
- Overseeing and mentoring junior circuit designers
- Experience as chip lead with success in silicon
- Experience in taking chips to mass production
- Ability to translate chip level specifications into architecture
- Strong communication, presentation and documentation skills.
Additional Information
Expected Base Pay Range (USD)
$145,300 $215,010 Annually
Relocation Available Nationwide
Annual Bonus up to 17%
Sponsorship Will Be Considered
All your information will be kept confidential according to EEO guidelines.
CCG Talent Management is not only a business solutions company but a company that believes success starts with the individual. CCG Business Solutions has been consulting and providing talent placement services since 2007. Our team understands the principles of connecting purpose to business. We are currently recruiting for a Principal Analog MixedSignal Design Engineer.
Job Description
The Principal Analog MixedSignal Design Engineer will contribute to the development of multitens of GHz Transimpedance amplifiers TIAs. These optical interface chips are tightly coupled with our highperformance equalizers. The results of our innovative designs have made our TIAs best in class for coherent longhaul and metro systems as well as PAM4 data center systems. Hybrid position, must work inoffice two (2) days a week.
Responsibilities:
- Active circuit design as well as technical leadership.
- Design leading edge transimpedance amplifier design, primarily in Silicon Germanium (SiGe) BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) technology, where circuit performance will need to transcend beyond industry leading products.
- Develop transmission line structures and other millimeter wave structures to enable higher performance than would normally be achievable.
- Design of hiperformance broadband analog circuits for optical frontend receivers.
- Design of various other analog circuits including linear regulators, AGC loop, currentvoltage sensors, bandgaps etc.
- Develop microarchitecture of major circuit blocks and guide team of designers to implement them. Work with various technologies including SiGe BiCMOS and CMOS.
- Work with other functional groups to facilitate postsilicon validation, qualification, transition to mass production, and customer support.
QualificationsBachelor’s degree in Electrical Engineering
Must have the following skillsbackground in the areas of design of highperformance RFAnalog ReceiverTIA design and 10 15 years experience Or MSc EE Or PhD EE with 5+ years of experience in the areas of design of highperformance RFAnalog ReceiverTIA design.
- Proven experience in IC design including chip tapeout AND lab evaluation of receiver design working in the industry).
- Solid experience in.
- Using EDA CAD tools
- Performing Analog Custom Layout
- Experience in measuring IC performance and debug of design to correlate simulations to measurements
- Deep understanding of fundamentals, including:
- Detailed transistor level design
- Device physics
- ControlFeedback loop stability analysis
- Direct project experience in at least one of the following areas is a plus:
- AGC loop design
- High precision analog circuits (Including linear regulators, current sensors, bandgaps and DACADC)
- Experience in CTLE design
- Experience in PackageSystem integration issues desired
- Project experience in using different technologies. (SiGe BiCMOS is a plus)
- A teamplayer
- Experience in the following is a strong plus:
- Overseeing and mentoring junior circuit designers
- Experience as chip lead with success in silicon
- Experience in taking chips to mass production
- Ability to translate chip level specifications into architecture
- Strong communication, presentation and documentation skills.
Additional Information
Expected Base Pay Range (USD)
$145,300 $215,010 Annually
Relocation Available Nationwide
Annual Bonus up to 17%
Sponsorship Will Be Considered
All your information will be kept confidential according to EEO guidelines.
The Principal Analog MixedSignal Design Engineer will contribute to the development of multitens of GHz Transimpedance amplifiers TIAs. These optical interface chips are tightly coupled with our highperformance equalizers. The results of our innovative designs have made our TIAs best in class for coherent longhaul and metro systems as well as PAM4 data center systems. Hybrid position, must work inoffice two (2) days a week.
Responsibilities:
- Active circuit design as well as technical leadership.
- Design leading edge transimpedance amplifier design, primarily in Silicon Germanium (SiGe) BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) technology, where circuit performance will need to transcend beyond industry leading products.
- Develop transmission line structures and other millimeter wave structures to enable higher performance than would normally be achievable.
- Design of hiperformance broadband analog circuits for optical frontend receivers.
- Design of various other analog circuits including linear regulators, AGC loop, currentvoltage sensors, bandgaps etc.
- Develop microarchitecture of major circuit blocks and guide team of designers to implement them. Work with various technologies including SiGe BiCMOS and CMOS.
- Work with other functional groups to facilitate postsilicon validation, qualification, transition to mass production, and customer support.
- Proven experience in IC design including chip tapeout AND lab evaluation of receiver design working in the industry).
- Solid experience in.
- Using EDA CAD tools
- Performing Analog Custom Layout
- Experience in measuring IC performance and debug of design to correlate simulations to measurements
- Deep understanding of fundamentals, including:
- Detailed transistor level design
- Device physics
- ControlFeedback loop stability analysis
- Direct project experience in at least one of the following areas is a plus:
- AGC loop design
- High precision analog circuits (Including linear regulators, current sensors, bandgaps and DACADC)
- Experience in CTLE design
- Experience in PackageSystem integration issues desired
- Project experience in using different technologies. (SiGe BiCMOS is a plus)
- A teamplayer
- Experience in the following is a strong plus:
- Overseeing and mentoring junior circuit designers
- Experience as chip lead with success in silicon
- Experience in taking chips to mass production
- Ability to translate chip level specifications into architecture
- Strong communication, presentation and documentation skills.
Additional Information
Expected Base Pay Range (USD)
$145,300 $215,010 Annually
Relocation Available Nationwide
Annual Bonus up to 17%
Sponsorship Will Be Considered
All your information will be kept confidential according to EEO guidelines.
- Direct project experience in at least one of the following areas is a plus:
Qualifications
Bachelor’s degree in Electrical Engineering
Must have the following skillsbackground in the areas of design of highperformance RFAnalog ReceiverTIA design and 10 15 years experience Or MSc EE Or PhD EE with 5+ years of experience in the areas of design of highperformance RFAnalog ReceiverTIA design.
Required profile
Experience
Other Skills
- Teamwork
- Communication
- Leadership