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Cryogenic & Packaging Engineer – Quantum Hardware (Cryogenic System)

Role overview

Qualifications

  • Background in cryogenic engineering, RF packaging, or applied physics
  • Experience with cryogenic systems and materials
  • Strong experimental and problem-solving skills

Responsibilities

  • Design chip packaging for cryogenic environments
  • Optimize thermalization, wiring, and signal integrity
  • Reduce loss, crosstalk, and spurious modes
  • Work closely with qubit, control, and cryo teams

Key facts

Other skills

  • Problem Solving
  • Collaboration

About the company

Anyon Technologies logo

Anyon Technologies

Anyon Technologies (known in US as Anyon Computing Inc) delivers a comprehensive, vertically integrated solution with proprietary technologies, ranging from large-scale modular quantum processors to scalable real-time quantum control electronics, and a natively supported quantum application development toolkit, empowering developers and users in one seamless package

Company details

Company size11 - 50

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Job description

About Us:

Anyon Systems is building the next generation of superconducting quantum computers. We design and operate full-stack quantum systems, from fabrication and cryogenics to control electronics, calibration, and software. What differentiates Anyon is execution speed, technical depth, and a relentless focus on making quantum hardware work in practice, not just on paper. Our Tel Aviv R&D center is a critical powerhouse driving Anyon Systems’ global quantum roadmap. Far from a traditional satellite office, this strategic hub owns the core pillars of our technology: quantum control, calibration, benchmarking, and AI-first automation. We deliberately anchored this team in Israel to leverage the ecosystem’s unmatched pedigree in deep-tech execution, defense-grade engineering, and rigorous applied research. As a member of this team, you will operate with complete autonomy and high agency, directly shaping the flagship products deployed to our customers worldwide.


Role Overview: 

You will design cryogenic integration and packaging solutions critical to scaling superconducting quantum processors.


Key Responsibilities: 

  • Design chip packaging for cryogenic environments
  • Optimize thermalization, wiring, and signal integrity
  • Reduce loss, crosstalk, and spurious modes
  • Work closely with qubit, control, and cryo teams
  • Support bring-up and debugging of new hardware


Qualifications: 

  • Background in cryogenic engineering, RF packaging, or applied physics
  • Experience with cryogenic systems and materials
  • Strong experimental and problem-solving skills


What We Offer: 

  • Core technical roles in a rapidly scaling quantum hardware company
  • Direct access to real, state-of-the-art quantum processors
  • High autonomy, technical ownership, and short feedback loops
  • Collaboration with world-class experimental, theoretical, and AI teams
  • Competitive Israeli-market compensation and meaningful equity
  • Flexible work culture focused on results and execution
  • Opportunity to shape the future architecture of quantum systems

 

Security / Defense Backgrounds:  Candidates with backgrounds in defense, aerospace, intelligence, secure systems, RF, real-time systems, or classified R&D environments are strongly encouraged to apply. Experience operating complex systems under strict performance, reliability, and security constraints is highly valued.

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MR

Marcus Rivera

Chief Revenue Officer

m.rivera@company.com
linkedin.com/in/marcusrivera
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