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Senior Package Engineer

Key Facts

Remote From: 
Full time
Senior (5-10 years)
English

Other Skills

  • •
    Leadership
  • •
    Multitasking
  • •
    Teamwork
  • •
    Verbal Communication Skills
  • •
    Social Skills
  • •
    Problem Solving

Roles & Responsibilities

  • MSc or equivalent experience in Mechanical Engineering, Materials Engineering, or related field
  • At least 5 years of experience developing complex packaging processes (warpage, thermal, optics, adhesives, etc.)
  • Experience collaborating with subcontractors and vendors
  • Strong interpersonal, communication, project management, and multitasking skills; team-oriented

Requirements:

  • Lead the development of advanced microelectronics packaging for NVIDIA Networking Business Unit's future products
  • Collaborate with world-leading vendors to develop ambitious packaging solutions
  • Lead task forces to investigate production excursions, failure analysis, and reliability issues
  • Provide failure investigations and production support for high-volume products

Job description

At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.

What you'll be doing:

  • Leading the development of groundbreaking microelectronics packaging for Nvidia Networking Business Unit's future products

  • Collaborating with world-leading vendors to develop highly ambitious packaging solutions

  • Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues

  • Failure investigations and production support for High volume products

What we need to see:

  • MSc or equivalent experience in Mechanical Engineering / Materials Engineering or similar

  • At least 5 years of experience with development of complex processes (warpage, heat, optics, Adhesives, etc).

  • Experience co-working with subcontractors and vendors

  • Vision and focus for projects and team

  • Curious and creative problem solver as well as organized and multi-tasker

  • Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)

  • High awareness of quality, manufacturability and project schedule

Ways to stand out of the crowd:

  • Proven record in packaging development

  • Background in semiconductor manufacturing processes and optical systems

Join us at NVIDIA, an equal-opportunity employer that values diversity and inclusion. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities throughout the recruitment process. If you require accommodations, please let us know and we will work with you to meet your needs. Apply now to be part of our world-class team and contribute to the future of computing!

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