Offer summary

Qualifications:

Ph.D. in Optical Communications, Photonics, or Electrical Engineering preferred., Over 15 years of experience from technology to productization., Deep knowledge of InP/SiP photonics, high baud-rate DSP ASICs, and optical integration., Strong publication and patent portfolio, with leadership in standards and ecosystem initiatives..

Key responsibilities:

Define and deliver strategy for integrated solutions across data center networks.

Guide innovation in vertical integration of photonics, NPU/DSP, and packet-optical systems.

Collaborate with hyperscaler and service provider customers to align product features with deployment needs.

Represent the company in industry conferences, standards bodies, and foster R&D partnerships.

Job description

NonCA Pay Range (Annual):

$210,000.00 $390,000.00

At Infinera, your base pay is one part of your total compensation package. Your actual base pay will depend on your skills, qualifications, experience, and location. This role may be eligible for equity grants, discretionary bonuses, or commission payments. The amount of these incentives is based on the terms of the Company’s incentive plans, the Company’s financial performance, andor individual employee job performance.

Infinera also offers paid leave, medical,

dental, and vision coverage, 401(k),

life, and disability insurance to

eligible employees.

SR Principal or Distinguished Engineer (may have him manage members of team)

Team: Office of the CTO

Location: USA or Remote

We’re seeking a worldclass innovative leader to define the vision and roadmap for embedded, pluggable coherent, data center optics, including DSP ASICs, PICs, materials and nextgeneration transport systems. This individual will shape product strategies that deliver ultraefficient, highcapacity interconnects for AI infrastructure (including CPO, OBO, LPO,…), data center interconnect (DCI), metro, and longhaul networks.

You will drive innovation across silicon photonics, Indium Phosphide, DSP, as well as vertically integrated solutions including on switching platforms — ensuring product lines remains at the technological forefront.