Principle Hardware Engineer Advanced Packaging

Natcast (short for The National Center for the Advancement of Semiconductor Technology) is a new, purposebuilt, nonprofit entity created to operate the National Semiconductor Technology Center (NSTC) consortium, established by the CHIPS Act of the U.S. government.

Working at Natcast represents an opportunity to help extend America’s leadership in semiconductor technology, significantly reduce the time and cost of moving from idea to commercialization, and build and sustain a semiconductor workforce development ecosystem.

These efforts to advance semiconductor technology and seed new industries built on the capabilities of a wide range of advanced chips hold the potential to benefit the country and the world for generations to come.

In this role you will pioneer nextgeneration semiconductor packaging technologies, driving innovation in heterogeneous integration while collaborating with leading experts across the semiconductor ecosystem to advance Americas technical capabilities.

Every day you will push the boundaries of advanced packaging solutions, develop novel integration approaches, and collaborate with crossfunctional teams to solve complex technical challenges that enable breakthrough semiconductor innovations.

To thrive in this role, you must combine deep technical expertise with innovative thinking, demonstrating the ability to both develop sophisticated packaging solutions and drive technical advancement through collaborative research.

Natcast stands at the forefront of semiconductor research and engineering, serving as a crucial hub for innovation in the U.S. semiconductor ecosystem. Through the National Semiconductor Technology Center (NSTC), Natcast drives technological advancement through collaborative partnerships, cuttingedge facilities, and a commitment to maintaining U.S. leadership in semiconductor technology.

This position plays a crucial role in advancing semiconductor packaging capabilities. The role requires sophisticated technical expertise combined with strong collaborative abilities to drive innovation in heterogeneous integration and chipletbased architectures.

Responsibilities:

• Drive technical strategy for heterogeneous integration and chiplet architectures

• Design and optimize advanced 2.5D3D packaging structures

• Lead development of novel process flows for chiplet integration

• Solve complex thermal and mechanical packaging challenges

• Direct technical investigations and failure analysis

• Collaborate with academia, national labs, and industry partners

• Support advanced characterization initiatives

• Provide technical leadership and mentorship

• Guide packaging reliability assessments

• Develop innovative integration solutions

• Lead crossfunctional technical programs

Required Skills and Experience:

• MastersPhD in Electrical Engineering, Materials Science, or related field

• 1015+ years semiconductor packaging experience

• Deep expertise in heterogeneous integration

• Strong background in chiplet architectures

• Experience with 3D integration technologies

• Excellence in technical problemsolving

• Track record of innovation leadership

• Strong collaborative abilities

• Advanced analytical capabilities

• Demonstrated research excellence

Preferred Skills and Experience:

• Published technical paperspatents

• Experience with technology transfer

• Knowledge of reliability standards

• Crossorganizational project leadership

• Academicgovernment collaboration background

• Prototypetoproduction expertise

Ready to advance semiconductor innovation through packaging excellence? Join our team and help develop the technologies that will strengthen domestic semiconductor capabilities for generations to come. Apply now to contribute to this critical mission!

Natcast is an equal opportunity employer. We do not discriminate based on race, color, religion, gender, gender expression, age, national origin, disability, marital status, sexual orientation, military status, or any protected attribute. We encourage qualified candidates from all backgrounds to apply and join us in our mission. If you require accommodation at any stage of the application process due to a disability, please let us know.

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