Module Reliability Engineer

Module Reliability Engineer

Location: Cambridge

Department: New Product Introduction

Reports To: Director NPI

Job Type: Full-Time, Permanent

About Us:

Forefront RF is an innovative fabless semiconductor company developing cutting-edge RF technology for mobile device manufacturers. Our mission is to revolutionize RF front-end technology by enabling seamless global connectivity – and ultimately, to unlock the long-standing vision of true software-defined radio. We are developing advanced, multi-chip RF modules that integrate adaptive circuitry, digitally controlled components, embedded software, and complex analog/RF designs into highly compact form factors.

Our Values:

We place a strong emphasis on fostering a culture rooted in collaboration, teamwork, and accountability. We believe that when we work together, drawing on each team member’s unique strengths, we can achieve remarkable results.

Our commitment to integrity, respect, honesty, and openness forms the foundation of our interactions, both within the company and with our valued partners and clients. We encourage ambition, initiative, and visionary thinking, as we understand that these qualities drive innovation and propel us towards success.

In addition, we value adaptability, proactivity, and resilience. We are looking for individuals who are comfortable with ambiguity and can navigate through it, demonstrating a proactive approach to problem-solving.

These values collectively define who we are and want to be as a team and guide us as we navigate the exciting journey ahead. If you align with our mission and values, and are ready to grow with us, we would love to hear from you.

Job Overview:

This is an exciting opportunity to join Forefront RF at an early stage, and have a real impact. We are looking for an experienced Module Reliability Engineer to take ownership of the reliability qualification of our novel RF System-in-Package (SiP) modules. In this hands-on and cross-functional role, you will ensure our technology meets the stringent robustness and reliability requirements of high-volume telecom applications.

As a Module Reliability Engineer, you will be responsible for ensuring that Forefront RF’s novel RF (SiP) modules meet stringent robustness and reliability requirements. You will define, execute, and analyze test plans to validate new materials, assembly processes, packaging schemes under realistic and accelerated conditions.

This role is essential in bridging R&D innovation with product robustness enabling our technology to meet the standards of high-volume telecom customers worldwide.

Key Responsibilities:

• Develop and execute reliability qualification plans for new RF modules (incl. thermal cycling, vibration, mechanical shock, moisture sensitivity, etc.).
• Design and implement custom stress and test setups where needed.
• Manage external labs or partners for outsourced testing, reliability qualification and failure analysis.
• Collaborate with design, packaging, and test engineering teams to address and mitigate identified reliability risks.     
• Lead Design-for-Reliability (DfR) reviews in early development stages.
• Analyse test results using statistical methods (Weibull, MTTF, etc.) to derive product lifetime and identify weak points.
• Work closely with foundries, assembly and test houses, and customers to support qualification activities and external reliability audits.
• Maintain compliance with industry standards (e.g., JEDEC, ISO 9001).
• Contribute to the development of reliability documentation and customer reports.

Requirements

About you:

You’re excited by the opportunity to work with breakthrough technologies. You may thrive in this role if you have some or all of the following:

• Degree in Electronics, Materials Science, Mechanical Engineering, or equivalent
• Demonstrable experience in reliability engineering within RF, semiconductors, or advanced electronics.
• Familiar with JEDEC reliability standards and environmental stress testing.
• Solid understanding of RF (SiP) module architectures and the impact of packaging on performance and reliability.
• Demonstrated expertise in thermal and mechanical simulation of RF modules and electronic assemblies, using advanced tools to predict stress, fatigue life, and heat distribution under accelerated testing conditions.
• Experience with failure analysis methods including cross-sectioning, X-ray inspection, SEM/EDX, and other techniques to identify material, mechanical, or process-related defects.
• Proficiency in data analysis tools (e.g., JMP, Minitab, Python).

Benefits

• Opportunity to work at the cutting edge of wireless technology.
• Dynamic, startup-like environment with close collaboration across disciplines.
• Ownership and visibility—your contributions will directly shape the company’s success.
• Competitive salary and pension contributions.
• Company share option scheme.
• 25 days holiday + national holidays.
• Weekly company lunches.
• Flexible work hours and remote work options.

We believe in equal opportunities

We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, colour, sex, gender identity, sexual orientation, age, non-disqualifying physical or mental disability, national origin, veteran status, or any other basis covered by appropriate law. All employment is decided on the basis of qualifications, merit, and business need.