PGDM Wafer Level Assembly Intern

Job Details:

Job Description: 

In this role, you will support Advance Packaging Wafer level Assembly equipment and process engineering task to establish and maintain a startup and sustaining program that is best in class for safety, cost-effectiveness, uninterrupted operation, and compliance with Intel standards. Responsibilities will include, but are not limited to:
1) Involved in supporting the startup, development, and experimentation of manufacturing engineering processes to ensure the highest safety and quality standards while maintaining cost efficiency.
2) High passion for learning and ability to analyze data to Identify system enhancements, and optimization opportunities and put the roadmap for implementation.
3) Able to have some work hour flexibilities while performing direct observation and experiments in the production environment.
4) Support critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits.
5) Takes part into execution of maintenance and repair activities for equipment and relevant module of components
6) Support the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield)
7) Supports development and optimization of excursion prevention systems for the equipment and process.
8) Supports factory ramps which includes equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and 2, Intel qual and manufacturing readiness processes).
10) Presence to work on site (No hybrid mode/ work from home)

The successful candidate should exhibit the following behavioral traits:
1) Must have role model safety as a value and adhere to stringent environmental compliance culture.
2) Excellent written and verbal communication skills required, strong organization and time management skills.
3) Excel as an individual contributor and part of a team and work effectively.

Qualifications:

• Pursuing Bachelor's Degree in Manufacturing Engineering, Computer Science, Computer Engineering, Industrial Engineering, Data Science or any other Engineering or related field of study.
• Knowledge in data science, SQL, Phyton, statistics, manufacturing science, advanced Excel, Power BI, project management, and Lean will be an added advantage.
• Looking for interns and students who show a strong interest in exploring and working on data analytics, predictive analysis, machine learning, and AI to enable advanced manufacturing.
• Preferably, an internship duration of 6 -9 months.

          

Job Type:

Student / Intern

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Penang

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.