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SI/PI Application Engineer

Remote:

Full Remote

Contract:

Full time

Experience:

Senior (5-10 years)

Work from:

Taiwan

Offer summary

Qualifications:

8+ years of experience in SI/PI design, Experience in PCB manufacturing and layout, Knowledge of high-speed signal integrity, Proficient with lab equipment for analysis, Fluency in English (spoken and written) desired.

Key responsabilities:

Evaluate design trade-offs with overseas teams
Perform SI analysis for high-speed SerDes
Provide global technical support to customers
Support product design and debugging
Facilitate collaboration across multiple teams

Fyte Human Resources, Staffing & Recruiting SME

51 - 200 Employees

See more Fyte offers

Job description

Your missions

Required Experience

Demonstrable expertise in high-speed signal circuit design, modeling, validation, and debugging.
Experience managing PCB manufacturing, layout, and population suppliers for complex high-speed signal designs.
Detailed knowledge of signal and power integrity design, layout, and manufacturing practices for high-speed differential pairs.
Proficient with lab and debug equipment for high-speed signal analysis.
Awareness of customer manufacturing techniques, end-of-line testing, quality assurance, and acceptance testing in a high-end consumer electronics environment.
Experience with on-site integration and hardware solutions at customer locations and ODMs.
At least 8 years of relevant work experience.
Experience working closely with internal engineering teams to leverage expertise, improve current solutions, develop IP, and influence the roadmap.
Provide technical expertise in both pre- and post-sales engagements with field teams and customers throughout the product lifecycle.
Develop customer-facing technical collateral to support, demonstrate, evaluate, promote, and sell products.
Simulation of high-speed digital design and EMC/EMI testing and mitigation of field effects on signal integrity.
Fluent in English (spoken and written) is desirable. Studying is acceptable.
Ability to work at both the system design level and the circuit and register space.
Experience in hardware failure analysis and root cause identification.
In-depth knowledge of circuit design, power design, PCB layout, and signal integrity with hands-on experience.
Experience with package, die, module, or board-level SIPI characterization using equipment (VNA, TDR, and Oscilloscope).
Good understanding of fundamental SI/PI concepts, including s-parameter, transmission line, microwave theory, PDN, etc.
Solid knowledge of IBIS AMI based channel simulation, including parameter sweep, design trade-offs, and PDN.
Extensive experience with Allegro PCB layout review and strong command of SI/PI routing rules.
Plus points: Allegro layout skills, experience with package material/technology, IC design, and thermal simulation skills.

Required Skills

Ability to work closely with various internal teams in Hardware and Software Engineering, Systems, Field Applications Engineering, Sales, Marketing, and Standards Bodies (USB-IF, PCI-Sig).
Strong communication skills, comfortable interfacing at all levels internally and with customer organizations.
Track record of supporting complex customer designs from concept through to mass production.
Strong team-player and practical hands-on problem solver.
Ability to multitask in a high-energy environment.
Ability to drive architecture of both customer designs and internal reference designs.
Excellent written and verbal communication skills with enthusiasm for solving customer problems collaboratively.
Comfortable interfacing with some of the largest electronics OEMs and ODMs in the consumer electronics market.
Experience with equipment used to replace electronic components (soldering equipment).
Familiar with at least one popular simulation tool such as ADS, HyperLynx, Nexxim, etc.

Responsibility and Authority

Work with overseas system design teams to evaluate design trade-offs and optimize design performance, risk, cost, and manufacturability through all design phases.
Perform both pre- and post-layout SI analysis for board-level high-speed SerDes and model PDN.
Provide best-in-class support to customers worldwide to resolve challenging technical issues and ensure successful integration of IP and product solutions.
Provide SI/PI support to customers and the field team during product design and/or product certification, including requirements, design specifications, and system debugging.
Provide direction for the business using demonstrable technical leadership in high-speed interface manufacturing, hardware integration, and system-level qualification.
Be a galvanizing force within the company linking sales, marketing, R&D, design, and operations teams.
Address design issues, customer issues, and internal deliverables to achieve success.