Offer summary

Qualifications:

MS or PhD in Electrical Engineering, Photonics, or related field., 15+ years of experience in optical and CMOS packaging, with a focus on bringing new technology to market., Proven leadership in advanced packaging, particularly with interconnect products and chiplets., Strong understanding of packaging challenges and relationships with OSATs..

Key responsibilities:

Own the companywide 2D, 2.5D, and 3D packaging roadmap and technology development.

Collaborate with module partners to create product differentiation.

Lead architecture, design, and product definition for early-stage product concepts.

Represent Lumentum at industry standards and events.

Job description

It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.

If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

Lumentum Holdings is seeking an experienced, passionate Senior technology leader to drive our advanced packaging strategy. In this critical role, you will engage with executive and engineering leadership to define and drive the packaging roadmap for optical transceivers, high speed components, and advanced co-packaged optics solutions. You will engage with key customers to constantly iterate our approach, and drive solutions that create technology differentiation along our product lines. The successful candidate will also drive product definition and product architecture for our advanced packaging focused activities, making tradeoffs that balance technical risk with financial returns and time to market

Key responsibilities:

Owns companywide 2D, 2.5D, and 3D packaging roadmap and technology development.
Works closely with current module partners to create differentiation for Lumentum products.
Drives long term partnerships for all forward looking packaging related technology development.
Leads the architecture, design, and initial product definition for Lumentums’ early-stage product concepts, making the appropriate tradeoffs between technical and business risk.
Represents Lumentum at various standards and industry leading events.

Education

MS, PhD, Electrical Engineering, Photonics, or related field.

Qualifications:

15+ years experience within the optical and CMOS packaging. Direct experience bringing new technology to market highly preferred.
Proven, knowledgeable leader within advanced packaging space with specific focus on interconnect products and chiplets.
History of delivering cutting edge optical products into the market under competitive market conditions. History of product definition and high level of product differentiation.
Extensive experience with advanced packaging technology including CoWoS, fan out package on package, die stacking, and
Strong understand and relationships with packaging OSATs. Experience working with OSATs to bring advanced packaging products to market.
Excellent knowledge of how to assess packaging related challenges, including stress, strain, warpage, and deformation. Ability to model and take the lead on assessing packaging risk is a major plus.
Excellent written, presentation, and communication skills.

Pay Range:

P90-USA-1 :$156,800.00 - $224,000.00

Disclaimer:

Final base salary for the successful candidate will depend on multiple factors, including but not limited to, job location, where work will be performed, qualifications, work history and relevant experience. With our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits.

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