Natcast (short for The National Center for the Advancement of Semiconductor Technology) is a new, purpose-built, non-profit entity created to operate the National Semiconductor Technology Center (NSTC) consortium, established by the CHIPS Act of the U.S. government.
Working at Natcast represents an opportunity to help extend America’s leadership in semiconductor technology, significantly reduce the time and cost of moving from idea to commercialization, and build and sustain a semiconductor workforce development ecosystem.
These efforts to advance semiconductor technology and seed new industries built on the capabilities of a wide range of advanced chips hold the potential to benefit the country and the world for generations to come.
Director of Advanced Packaging & Heterogeneous Integration
Tempe, AZ
In this role you will pioneer next-generation semiconductor packaging solutions, leading breakthrough innovations in heterogeneous integration that advance America's technological capabilities.
Every day you will drive complex integration strategies for cutting-edge chiplet technologies, collaborating with industry experts to develop advanced packaging solutions that define the future of semiconductor systems.
To thrive in this role you must combine deep technical expertise in advanced packaging and heterogeneous integration with strategic leadership abilities and a proven track record of driving innovation in complex semiconductor environments.
Natcast, operating the National Semiconductor Technology Center (NSTC) stands at the forefront of America's semiconductor ecosystem. This groundbreaking public-private partnership unites industry leaders, academic researchers, and government stakeholders in advancing U.S. semiconductor capabilities through collaborative innovation.
Position Summary: The Director of Advanced Packaging & Heterogeneous Integration role presents an extraordinary opportunity to shape the future of semiconductor systems. Leading technical strategy and execution at our state-of-the-art facility, this position directly impacts the development of next-generation packaging technologies while working with cutting-edge processes and industry-leading partners.
Responsibilities:
Lead heterogeneous integration strategy and execution
Direct complex packaging process development
Drive chiplet integration optimization
Oversee 3D packaging technology development
Manage materials integration initiatives
Lead thermal and mechanical solution development
Direct advanced characterization programs
Guide integration engineering teams
Manage strategic technology partnerships
Drive innovation in packaging solutions
Required Skills and Experience:
PhD or Master's in Electrical Engineering, Materials Science, or related field
15+ years semiconductor integration experience
Deep expertise in advanced packaging technologies
Strong background in chiplet integration
Proven leadership in 3D packaging development
Excellence in materials integration
Track record of successful technology transfer
Strong team leadership capabilities
Preferred Skills and Experience:
Patent portfolio in advanced packaging
Industry-academic collaboration experience
Multi-site project management expertise
Published research in heterogeneous integration
International partnership experience
Ready to pioneer the future of semiconductor packaging? Join Natcast in strengthening America's technological leadership through advanced integration solutions.
Natcast is an equal opportunity employer. We do not discriminate based on race, color, religion, gender, gender expression, age, national origin, disability, marital status, sexual orientation, military status, or any protected attribute. We encourage qualified candidates from all backgrounds to apply and join us in our mission. If you require accommodation at any stage of the application process due to a disability, please let us know.
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